{
  "generated": "2026-07-05T19:00:00Z",
  "status": "seed-mvp",
  "source_note": "Curated-first seed graph for LLMgram Hardware Red Room. Edges are intentionally conservative and source-backed where possible; future pipeline will propose candidates from AI Signal.",
  "tiers": [
    "materials-gases",
    "lithography-equipment",
    "foundry",
    "memory-hbm",
    "packaging-test",
    "chip-designers",
    "servers-networking",
    "power-cooling",
    "datacenters-neoclouds",
    "labs-hyperscalers",
    "capital-finance"
  ],
  "entities": [
    {"id":"air-liquide","name":"Air Liquide","tier":"materials-gases","country":"FR","type":"industrial-gases","role":"Ultra-pure industrial gases for semiconductor fabs and advanced packaging.","why":"Non-obvious AI hardware supplier: fabs and HBM/packaging ecosystems need ultra-pure gases; new gas units can signal upstream capacity buildout.","sources":[{"title":"Air Liquide invests over $170M to support SK hynix AI memory ecosystem","url":"https://www.airliquide.com/group/press-releases-news/2026-07-01/air-liquide-invests-over-170m-usd-us-support-sk-hynixs-ambition-build-global-ai-memory-ecosystem"}]},
    {"id":"linde","name":"Linde","tier":"materials-gases","country":"IE/UK","type":"industrial-gases","role":"Industrial and specialty gases for semiconductor manufacturing.","why":"Same hidden-infrastructure layer as Air Liquide: gas supply is a fab dependency and expansion signal.","sources":[{"title":"Linde electronics and specialty gases","url":"https://www.linde.com/industries/electronics"}]},
    {"id":"asml","name":"ASML","tier":"lithography-equipment","country":"NL","type":"lithography","role":"EUV/DUV lithography systems used by leading-edge fabs.","why":"EUV availability constrains leading-edge logic nodes used for AI accelerators.","sources":[{"title":"ASML lithography principles","url":"https://www.asml.com/en/technology/lithography-principles"}]},
    {"id":"tsmc","name":"TSMC","tier":"foundry","country":"TW","type":"foundry","role":"Leading-edge foundry for GPUs/ASICs and advanced packaging capacity.","why":"Central node for AI accelerator manufacturing and CoWoS-style packaging bottlenecks.","sources":[{"title":"TSMC technology overview","url":"https://www.tsmc.com/english/dedicatedFoundry/technology"}]},
    {"id":"samsung-foundry","name":"Samsung Foundry","tier":"foundry","country":"KR","type":"foundry","role":"Advanced logic foundry and memory group adjacency.","why":"Alternative advanced node and packaging/memory ecosystem participant.","sources":[{"title":"Samsung Foundry","url":"https://semiconductor.samsung.com/foundry/"}]},
    {"id":"sk-hynix","name":"SK hynix","tier":"memory-hbm","country":"KR","type":"hbm-memory","role":"HBM supplier for AI accelerators.","why":"HBM is one of the hardest AI hardware bottlenecks; packaging plants and gas supply deals are leading indicators.","sources":[{"title":"Air Liquide / SK hynix Indiana AI memory ecosystem","url":"https://www.airliquide.com/group/press-releases-news/2026-07-01/air-liquide-invests-over-170m-usd-us-support-sk-hynixs-ambition-build-global-ai-memory-ecosystem"}]},
    {"id":"micron","name":"Micron","tier":"memory-hbm","country":"US","type":"hbm-memory","role":"Memory/HBM supplier.","why":"HBM and advanced memory capacity shape accelerator availability.","sources":[{"title":"Micron HBM","url":"https://www.micron.com/products/memory/hbm"}]},
    {"id":"nvidia","name":"NVIDIA","tier":"chip-designers","country":"US","type":"gpu-designer","role":"Dominant AI GPU platform and networking stack.","why":"Demand shaper for foundry, HBM, packaging, servers, networking, datacenters and capital deals.","sources":[{"title":"NVIDIA data center","url":"https://www.nvidia.com/en-us/data-center/"}]},
    {"id":"amd","name":"AMD","tier":"chip-designers","country":"US","type":"gpu-designer","role":"AI accelerator and CPU supplier.","why":"Second major merchant accelerator route; relevant for HBM/foundry/packaging competition.","sources":[{"title":"AMD Instinct accelerators","url":"https://www.amd.com/en/products/accelerators/instinct.html"}]},
    {"id":"broadcom","name":"Broadcom","tier":"chip-designers","country":"US","type":"custom-asic-networking","role":"Custom AI ASICs and networking silicon.","why":"Connects hyperscaler ASIC programs and networking bottlenecks.","sources":[{"title":"Broadcom AI infrastructure","url":"https://www.broadcom.com/"}]},
    {"id":"foxconn","name":"Foxconn","tier":"servers-networking","country":"TW","type":"server-assembly","role":"AI server manufacturing and integration.","why":"Turns GPUs/ASICs into racks; assembly capacity and customer mix are hardware signal.","sources":[{"title":"Foxconn","url":"https://www.foxconn.com/"}]},
    {"id":"supermicro","name":"Supermicro","tier":"servers-networking","country":"US","type":"ai-servers","role":"AI servers, racks and integration.","why":"Rack-scale deployment layer between chips and compute clusters.","sources":[{"title":"Supermicro AI solutions","url":"https://www.supermicro.com/en/solutions/ai"}]},
    {"id":"vertiv","name":"Vertiv","tier":"power-cooling","country":"US","type":"power-cooling","role":"Data center power and thermal infrastructure.","why":"AI clusters stress power delivery and cooling; supplier orders indicate datacenter ramp.","sources":[{"title":"Vertiv AI data centers","url":"https://www.vertiv.com/en-us/solutions/ai/"}]},
    {"id":"schneider-electric","name":"Schneider Electric","tier":"power-cooling","country":"FR","type":"power-management","role":"Electrical infrastructure, power management and datacenter systems.","why":"Power chain layer for AI datacenter buildout.","sources":[{"title":"Schneider Electric data centers","url":"https://www.se.com/ww/en/work/solutions/for-business/data-centers-and-networks/"}]},
    {"id":"ge-vernova","name":"GE Vernova","tier":"power-cooling","country":"US","type":"power-generation-grid","role":"Grid/power generation equipment.","why":"Large AI campuses trigger grid, turbines, transformer and energy procurement constraints.","sources":[{"title":"GE Vernova power","url":"https://www.gevernova.com/"}]},
    {"id":"coreweave","name":"CoreWeave","tier":"datacenters-neoclouds","country":"US","type":"neocloud","role":"GPU cloud / AI infrastructure operator.","why":"Capacity buyer/operator linking NVIDIA, datacenters, debt and AI labs.","sources":[{"title":"CoreWeave","url":"https://www.coreweave.com/"}]},
    {"id":"oracle","name":"Oracle","tier":"datacenters-neoclouds","country":"US","type":"cloud-datacenter","role":"Cloud and AI datacenter capacity provider.","why":"Major capacity counterparty for AI labs and Stargate-like deployments.","sources":[{"title":"Oracle Cloud Infrastructure","url":"https://www.oracle.com/cloud/"}]},
    {"id":"openai","name":"OpenAI","tier":"labs-hyperscalers","country":"US","type":"ai-lab","role":"Frontier AI lab and compute demand source.","why":"Demand driver for chips, datacenter capacity and capital structures.","sources":[{"title":"OpenAI","url":"https://openai.com/"}]},
    {"id":"anthropic","name":"Anthropic","tier":"labs-hyperscalers","country":"US","type":"ai-lab","role":"Frontier AI lab and compute demand source.","why":"Demand driver for cloud capacity and accelerator supply.","sources":[{"title":"Anthropic","url":"https://www.anthropic.com/"}]},
    {"id":"xai","name":"xAI","tier":"labs-hyperscalers","country":"US","type":"ai-lab","role":"Frontier AI lab / Colossus-scale datacenter operator.","why":"Direct signal through rapid datacenter buildout and accelerator procurement.","sources":[{"title":"Epoch AI data centers dataset","url":"https://epoch.ai/data/ai-data-centers"}]},
    {"id":"softbank","name":"SoftBank","tier":"capital-finance","country":"JP","type":"capital","role":"Strategic capital for AI infrastructure.","why":"Capital node for large AI infrastructure projects and circular investment patterns.","sources":[{"title":"SoftBank Group","url":"https://group.softbank/en"}]},
    {"id":"mgx","name":"MGX","tier":"capital-finance","country":"AE","type":"capital","role":"AI/infrastructure investment vehicle.","why":"Capital and geopolitical node in AI infrastructure buildout.","sources":[{"title":"MGX","url":"https://mgx.ae/"}]}
  ],
  "edges": [
    {"from":"air-liquide","to":"sk-hynix","kind":"supply","label":"ultra-pure gases for AI memory / advanced packaging","criticality":"high","source":"https://www.airliquide.com/group/press-releases-news/2026-07-01/air-liquide-invests-over-170m-usd-us-support-sk-hynixs-ambition-build-global-ai-memory-ecosystem"},
    {"from":"linde","to":"foundry-layer","kind":"supply","label":"industrial/specialty gases for semiconductor fabs","criticality":"medium","source":"https://www.linde.com/industries/electronics"},
    {"from":"asml","to":"tsmc","kind":"equipment","label":"EUV/DUV lithography systems","criticality":"very-high","source":"https://www.asml.com/en/technology/lithography-principles"},
    {"from":"asml","to":"samsung-foundry","kind":"equipment","label":"EUV/DUV lithography systems","criticality":"high","source":"https://www.asml.com/en/technology/lithography-principles"},
    {"from":"tsmc","to":"nvidia","kind":"manufacturing","label":"leading-edge manufacturing / advanced packaging","criticality":"very-high","source":"https://www.tsmc.com/english/dedicatedFoundry/technology"},
    {"from":"tsmc","to":"amd","kind":"manufacturing","label":"leading-edge manufacturing","criticality":"high","source":"https://www.tsmc.com/english/dedicatedFoundry/technology"},
    {"from":"sk-hynix","to":"nvidia","kind":"component","label":"HBM memory stack dependency","criticality":"very-high","source":"https://www.airliquide.com/group/press-releases-news/2026-07-01/air-liquide-invests-over-170m-usd-us-support-sk-hynixs-ambition-build-global-ai-memory-ecosystem"},
    {"from":"micron","to":"nvidia","kind":"component","label":"HBM memory supplier lane","criticality":"high","source":"https://www.micron.com/products/memory/hbm"},
    {"from":"nvidia","to":"coreweave","kind":"capacity/customer","label":"GPU cloud demand / AI infrastructure capacity","criticality":"high","source":"https://www.nvidia.com/en-us/data-center/"},
    {"from":"nvidia","to":"xai","kind":"capacity/customer","label":"accelerator platform for frontier clusters","criticality":"high","source":"https://epoch.ai/data/ai-data-centers"},
    {"from":"foxconn","to":"nvidia","kind":"server-integration","label":"AI server/rack manufacturing ecosystem","criticality":"medium","source":"https://www.foxconn.com/"},
    {"from":"supermicro","to":"datacenter-layer","kind":"server-integration","label":"AI server and rack deployment layer","criticality":"medium","source":"https://www.supermicro.com/en/solutions/ai"},
    {"from":"vertiv","to":"datacenter-layer","kind":"power-cooling","label":"power/thermal infrastructure for AI datacenters","criticality":"high","source":"https://www.vertiv.com/en-us/solutions/ai/"},
    {"from":"schneider-electric","to":"datacenter-layer","kind":"power-cooling","label":"electrical systems and power management","criticality":"high","source":"https://www.se.com/ww/en/work/solutions/for-business/data-centers-and-networks/"},
    {"from":"ge-vernova","to":"datacenter-layer","kind":"energy","label":"generation/grid equipment pressure from AI campuses","criticality":"medium","source":"https://www.gevernova.com/"},
    {"from":"oracle","to":"openai","kind":"capacity-deal","label":"cloud/datacenter capacity relationship to monitor","criticality":"high","source":"https://www.oracle.com/cloud/"},
    {"from":"softbank","to":"openai","kind":"capital","label":"strategic AI infrastructure capital lane","criticality":"medium","source":"https://group.softbank/en"},
    {"from":"mgx","to":"openai","kind":"capital","label":"AI infrastructure capital lane to monitor","criticality":"medium","source":"https://mgx.ae/"}
  ],
  "watchlist": [
    {"signal":"Ultra-pure gas plants near fabs/HBM packaging sites","why":"Hidden but early indicator of semiconductor capacity expansion.","example":"Air Liquide → SK hynix Indiana"},
    {"signal":"HBM allocation and advanced packaging capacity","why":"Can bottleneck GPU deliveries even when wafer capacity exists.","example":"SK hynix/Micron/Samsung ↔ NVIDIA/AMD/custom ASICs"},
    {"signal":"Power/cooling orders and grid interconnect requests","why":"AI campus feasibility often shifts from chips to electricity/cooling.","example":"Vertiv/Schneider/GE Vernova plus utility connections"},
    {"signal":"Capacity prepayments, JV, circular investments","why":"Capital flows reveal who is underwriting whose compute supply.","example":"labs ↔ clouds/neoclouds ↔ chip suppliers ↔ financiers"}
  ]
}